Here is the abstract you requested from the DPC_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|IC Packaging Trends Causing Concern in Complete Removal of Solder Flux|
|Keywords: Cleaning, Reliability, Flip chip|
|The complete cleaning and removal of flux / soil residues under low profile components (especially flip-chip devices) are becoming more critical, especially as the conductor spacings are decreasing and the power is increasing. If the residues are not completely removed, then the reliability of the circuit can be greatly affected. Packaging trends are pushing flip-chip bump pitch and sizes, causing tighter and smaller spaces to allow for adequate flux removal from under the package. All of the flux residue must be removed to ensure an acceptable bonding of the underfill material. Therefore, the cleaning process must be carefully examined and optimized to obtain maximum performance for removing the flux residues. The total cleaning process can be broken down into two subsets: the static cleaning rate and the dynamic cleaning rate. Static Cleaning Rate + Dynamic Cleaning Rate = Process Cleaning Rate This presentation will review cleaning problems brought about with the implementation of the latest technologies and explain how the cleaning process can be optimized to guarantee the reliability of the assemblies.|
|Rich Brooks, Regional Manager