Micross

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Packaging Strategies for Mitigation of Mechanical Noise in Sensor Systems
Keywords: mechanical noise, MEMS, vibration
Sensors are often required to operate within mechanical structures that present a variety of unwanted acoustic signals that can significantly deteriorate sensor performance. This problem is exacerbated when the sensor and associated electronics are reduced in size. MEMS devices by their very nature and size have mechanical resonances that are often in the hundreds of megahertz to gigahertz range. These ranges of frequencies are very difficult to measure and present unique problems for package design. In this paper we explore various techniques for mitigating these types of mechanical responses. We show how to properly characterize noise signatures and show how proper packaging design can be used to either block unwanted signals or reduce their amplitudes to acceptable levels.
Dr. Philip Reiner, Chief Scientist
CGI Federal
Huntsville, AL
USA


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