Abstract Preview

Here is the abstract you requested from the DPC_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Packaging of MEMS for Integrated RF Circuit Verifications
Keywords: Magnetic MEMS, Low noise amplifiers, Self-calibration
This paper provides development of MEMS switches and packaging of MEMS to test radio frequency circuits used in wireless products such as cell phones and network routers. We discuss fabrication of MEMS using low voltage magnetic materials and their configurations to achieve the optimum switch to test RF low noise amplifiers. We have accomplished a very unique methodology to test low noise amplifiers using built-in sellf-test technique and our MEMS switches are proposed to achieve the verification of low noise amplifiers. Furthermore, we have used MEMS switches that we developed to perform self calibration to correct for the parametric variations and faults within the deep submicron CMOS circuits. We also discuss packaging of MEMS and low noise amplifier using 3D TSV technology.
Bruce C. Kim, Associate Professor
University of Alabama
Tuscaloosa, AL

  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems