Here is the abstract you requested from the DPC_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|3D-IC Integration Using C2C or C2W Alignment Schemes Together with Local Oxide Reduction|
|Keywords: Flip Chip, Chip to Chip, Chip to Wafer, Oxide removal|
|3-Dimensional interconnection of high density integrated circuits enables building devices with greater functionality with higher performances in a smaller space. This paper explores the chip-to-chip and chip-to-wafer alignment and the associated bonding techniques such as in-situ reflow or thermocompression with a local oxide reduction which contributes to higher yield together with reduction of the force or temperature requirements.|
|Gilbert Lecarpentier, Product Manager
SET - Smart Equipment Technology
Saint Jeoire, BP24 Haute Savoie 74490,