Here is the abstract you requested from the DPC_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|2D/3D Inspection of mBumps & mPillars|
|Keywords: Cu Pillar uBumps, Metrology, Inspection|
|Bandwidth and power consumption have become the bottlenecks for next generation computing and mobile communication. To reduce these barriers, a revolution in packaging technology is required. 3D stacking is believed to be one of the technologies that will positively influence these parameters. A critical component in achieving this are TSV's combined with fine pitch, high density bumping technology. This paper will discuss the challenges that come with 2D and 3D inspection of small bumps & pillar's, discuss opportunities for in-line monitoring to improve process yield and reliability, give you an introduction to a novel, cost effective 3D inspection technology and will share measurement results from mBumps and mPillars with various materials and sizes down 20um.|
|Hubert Altendorfer, Sr. Director Corporate Marketing
KLA - Tencor