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PASSIVE KEYNOTE SPEAKER: RF System-in-Packages: History and Trend
Keywords: RF, SIP, Integration
In the last decade, people have seen tremendous increasing of data transmission speed and data storage capacity, which is mainly attributed to the Moore's law. However, this has little to do with RF devices and RF packages that are often used in the front-ends of wireless communication systems. Making components (e.g., width and spacing) smaller or closer does not necessarily help from RF perspectives, and as a result SoC (System on Chip) products for RF system do not really take off. The things that eventually make RF system evolution are from the concepts of System in Package, which may also include baseband chips and memory chips along with RF chips in a package. Substrate loss and metal loss are the key specifications to be considered for RF packaging. Several substrate technologies (e.g., laminate, LTCC, GaAs, glass, high-resistivity silicon, etc) that are typically used for RF packaging in the industry will be introduced. Some design challenges (e.g., impedance matching, minimizing coupling/cross-talk for high integration packages, etc) will be addressed. A trend for future RF packaging is drawn, based on successful examples of RF packaging in the industry.
Kai Liu, Senior Engineering Manager
STATS ChipPAC, Inc.
Tempe, AZ
USA


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