Here is the abstract you requested from the DPC_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Packaging of High Brightness LED’s|
|Keywords: LED, High Power, Packaging|
|A common approach for designing HB-LEDs into a variety of lighting systems is to arrange an array of many emitters over a large area in order to provide the required photometric flux. In certain applications, this common approach of arraying a large number of small chip LEDs introduces a number of challenges that can be solved by using a single package of big-chip LEDs with enough light output to meet the system requirements. This presentation will discuss package design for big-chip LEDs, compared to an array of many small emitter packages. In addition to big-chip package design, the impact on system design including optics, drivers, thermals, reliability, and form factor will be addressed. For illustration, a reference example will be presented in detail, consisting of an easy to use plug and play single package with 36mm2 of emitting area capable of up to 6000 lumens.|
|Lidia Lee, Packaging Engineering Manager
Luminus Devices, Inc.