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Packaging HB LEDs with Integrated Beamshaping
Keywords: Wafer Level Packaging, HB LED, new technology
LED light will dominate in future a lot of application fields in everyday life and it already started not only in consumer market. Therefore more and more applications require new ideas and approaches for packaging to fulfill upgraded requirements for protection, reliability, beam shaping and cost reduction, especially for High Brightness (HB) LEDs in e.g. automotive and other markets. This presentation will give an overview about the developed monolithic window with integrated anti-glare shield for HB LED packaging used in the automotive market for low and high beam headlights and other special lighting functions of modern cars. Apart from the component protection, the monolithic window ensures that there is sufficient contrast and thus glare protection in the irradiation area of the LED array. In addition future packaging technologies will be introduced to provide 3D interconnection and beam shaping by glass lenses. All discussed packaging ideas will meet the requirement of vacuum tight wafer level packaging by building monolithic packaging boards or capping wafers made of micro processed silicon and glass material.
Thomas Hoeftmann, R&D Manager
Plan Optik AG
Elsoff 56479,

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic