Here is the abstract you requested from the DPC_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|MEMS KEYNOTE SPEAKER: Advanced Packaging for Multi-Axis Resonant MEMS Gyroscopes|
|Keywords: MEMS Gyroscopes, Wafer & Die-Level Packaging, Inertial Measurement Unit (IMU)|
|This talk will discuss challenges and solutions for the wafer- and die-level packaging of multi-axis silicon resonant micro-gyroscopes. The motion and position of an object in space can be accurately mapped through the use of an inertial measurement unit (IMU), comprised of a tri-axial accelerometer and a tri-axial gyroscope. Inertial measurement units are being deployed in a myriad of consumer, automotive and industrial applications such as navigation, gaming, image stabilization in cameras, hand-held device user interfaces, and robotics. To leverage the full benefits of an IMU in these applications and to improve the accuracy for dead reckoning, a high-performance cost-effective tri-axial micro-gyroscope is needed; preferably a gyroscope manufactured in a process compatible with the micro-accelerometer to allow subsequent integration. Packaging represents a major challenge to the implementation of small form factor MEMS-based IMUs with high accuracy and stability. High quality factor (Q) mode-matched silicon-based bulk acoustic wave (BAW) gyroscopes offer high stability, low noise, large dynamic range, and wide bandwidth all in a small form factor, attributes that are needed to enable dead reckoning using IMUs. This presentation will present the latest advances in this area and compare performance of various high-Q MEMS gyroscopes.|
|Dr. Farrokh Ayazi, Professor & Co-Director
Georgia Institute of Technology