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MEMS KEYNOTE SPEAKER: Advanced Packaging for Multi-Axis Resonant MEMS Gyroscopes
Keywords: MEMS Gyroscopes, Wafer & Die-Level Packaging, Inertial Measurement Unit (IMU)
This talk will discuss challenges and solutions for the wafer- and die-level packaging of multi-axis silicon resonant micro-gyroscopes. The motion and position of an object in space can be accurately mapped through the use of an inertial measurement unit (IMU), comprised of a tri-axial accelerometer and a tri-axial gyroscope. Inertial measurement units are being deployed in a myriad of consumer, automotive and industrial applications such as navigation, gaming, image stabilization in cameras, hand-held device user interfaces, and robotics. To leverage the full benefits of an IMU in these applications and to improve the accuracy for dead reckoning, a high-performance cost-effective tri-axial micro-gyroscope is needed; preferably a gyroscope manufactured in a process compatible with the micro-accelerometer to allow subsequent integration. Packaging represents a major challenge to the implementation of small form factor MEMS-based IMUs with high accuracy and stability. High quality factor (Q) mode-matched silicon-based bulk acoustic wave (BAW) gyroscopes offer high stability, low noise, large dynamic range, and wide bandwidth all in a small form factor, attributes that are needed to enable dead reckoning using IMUs. This presentation will present the latest advances in this area and compare performance of various high-Q MEMS gyroscopes.
Dr. Farrokh Ayazi, Professor & Co-Director
Georgia Institute of Technology
Atlanta, GA
USA


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