Micross

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Here is the abstract you requested from the DPC_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

3D PACKAGING KEYNOTE SPEAKER: Demand and Applications for 3D TSV
Keywords: 3D, TSV, Packaging
ABSTRACT TO COME.
Jerome Baron, Analyst
Yole Développement, Inc.
Lyon 69006,
France


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