Here is the abstract you requested from the HiTEN_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|High Temperature Endurance of Packaged SOI devices for Signal Conditioning and Processing Applications|
|Keywords: Silicon on Insulator, Endurance, High temperature packaging|
|Silicon on Insulator (SOI) device technology is fulfilling a niche requirement for electronics that functions satisfactorily at operating temperatures of >200oC. Most of the reliability data on the high temperature endurance of the devices is generated on the device itself with little attention being paid to the packaging technology around the device. Similarly, most of the reliability data generated on high temperature packaging technologies uses testpieces rather than real devices, which restricts any conclusions on long term electrical performance. This paper presents results of high temperature endurance studies on SOI devices combined with high temperature packaging technologies relevant to signal conditioning and processing functions for sensors in down-well and aero-engine applications. The endurance studies have been carried out for up to 10,000 hours at 250oC, with functioning devices being tested periodically at room temperature, 125oC and 250oC. Different die attach and wire bond options have been included in the study and the performance of transistors, comparators, oscillators, voltage regulators, PTAT (Proportional to Absolute Temperature) functional blocks have been characterised. Analysis of failed devices has also been carried out to assess the dominant degradation mechanisms that occur during endurance testing at 250oC. This work formed part of the UPTEMP project which was set-up with support from UK Technology Strategy Board and the EPSRC. The project brought together a consortium of end-users (Sondex Wireline and Vibro-Meter UK), electronic module manufacturers (GE Aviation Systems Newmarket) and material suppliers (Gwent Electronic Materials and Thermastrate Ltd) with Oxford University - Materials Department, the leading UK high temperature electronics research centre.|
|Steve T. Riches, Business Development Manager
GE Aviation Systems - Newmarket
Newmarket, Suffolk CB8 0AU,