Micross

Abstract Preview

Here is the abstract you requested from the HiTEN_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Au-Sn SLID Bonding for High Temperature Applications
Keywords: High Temperature, Interconnect Technology, Au-Sn SLID bonding
Au-Sn solid-liquid-interdiffusion (SLID) bonding is a novel and promising interconnect technology for high temperature (HT) applications. In combination with Silicon Carbide (SiC) devices, Au-Sn SLID has the potential of being a key technology for the next generation of innovative, cost effective and environmental friendly drilling and well intervention systems for the oil industry. However, limited knowledge about Au-Sn SLID bonding for combined HT and high power applications is a major restriction to fully realize the high temperature potential of SiC devices. This paper presents a comprehensive study of fluxless Au-Sn SLID bonding. Two different processing techniques – electroplating of Au / Sn layers and sandwiching of eutectic Au-Sn preform between electroplated Au layers – have been studied in a simplified metallization system. The latter process was further investigated in two different Cu / Si3N4 / Cu / NiP / Au-Sn / Ni / Ni2Si / SiC systems (different Au-layer thickness). Die shear tests and cross-sections have been performed on “as bonded”, thermally cycled and thermally aged samples to characterize the bonding properties associated with the different processing techniques, metallization schemes and environmental stress tests. A uniform Au-rich bond interface is produced (Au5Sn with a melting point of 519°C). The importance of excess Au on both substrate and chip side in the final bond is demonstrated. It is shown that Au-Sn SLID can absorb thermo-mechanical stresses induced by large CTE mismatches (up to 12 ppm/K) in a packaging system during HT thermal cycling. The bonding strength of Au-Sn SLID is shown to be superb, exceeding 78 MPa. Importantly, Au-Sn SLID is shown to be an excellent interconnect technology for HT packaging.
Torleif A. Tollefsen Seip, PhD Student
SINTEF ICT, Instrumentation
OSLO 0373,
Norway


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems