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Characterization of LTCC-Thick Film Technology for 300°C Packaging
Keywords: high temperature, packaging, LTCC
Economic geothermal well construction and reservoir characterization requires high temperature logging tools and sensors with the long-term operation capability of 300°C. Low temperature co-fired ceramic (LTCC) and thick film technology make them a potential candidate for building interconnects to SiC device and functional analog or digital circuits to operate at that temperature. In this work, single conductor layer LTCC substrates have been fabricated to characterize the thick film Au adhesion under 300°C storage. The via reliability has been evaluated on the multi-layer LTCC substrates under temperature cycling of 35-325°C. In addition, die attach, wire bonding and stud bumping assembly techniques has been investigated.
Tan Zhang, Electronics Packaging Engineer
GE Global Research Center
Niskayuna, NY
USA


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