Here is the abstract you requested from the HiTEN_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Universal High-Temperature (250C) Test Fixture|
|Keywords: high-temperature test fixture, metal fatigue at temperature, high-temperature solder|
|There is a need for simple, easy to use test fixtures for testing new high-temperature electronic devices or complete high-temperature circuits without dealing with laser welding or high-temperature solders. This paper looks at the use of metal solderless connections and their fatigue over time at 225°C and 250°C. The use of conductive ceramic compounds and conductive epoxies for mounting gold plated high-temperature sockets will also be discussed.|
|Randy A. Normann, President
Forever Testing Company