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Nanocomposite Epoxy Resin for SiC Module
Keywords: SiC Module, Epoxy resin, Nanocomposite
The sealing resin of the high temperature resistance is necessary in the high temperature of 200℃ or more for an operable SiC module. The resin that can be used for the long-run at the current state and 200℃ or more has not been achieved yet though epoxy resin is used as a typical sealing resin conventionally.Whether an increase in the glass-transition temperature was possible by added the quartz filler of the nanosize to epoxy resin was studied. As a result, the glass-transition temperature was found being able to be increased at about 30℃ by adding the quartz filler of the nanosize to the polyfunctional epoxy resin and the amine setting agent.
Kenji Okamoto, Manager
Fuji Electric
Hino, Tokyo 191-8502,
Japan


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