Here is the abstract you requested from the HiTEN_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Nanocomposite Epoxy Resin for SiC Module|
|Keywords: SiC Module, Epoxy resin, Nanocomposite|
|The sealing resin of the high temperature resistance is necessary in the high temperature of 200℃ or more for an operable SiC module. The resin that can be used for the long-run at the current state and 200℃ or more has not been achieved yet though epoxy resin is used as a typical sealing resin conventionally.Whether an increase in the glass-transition temperature was possible by added the quartz filler of the nanosize to epoxy resin was studied. As a result, the glass-transition temperature was found being able to be increased at about 30℃ by adding the quartz filler of the nanosize to the polyfunctional epoxy resin and the amine setting agent.|
|Kenji Okamoto, Manager
Hino, Tokyo 191-8502,