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AUTHOR WITHDREW 9-13-11: Thermal Management of Focal Plane Assembly in the Hyperspectral Imager
Keywords: Thermal Management, TEC, Focal Plane Assembly
AUTHOR WITHDREW 9-13-11: We have worked on TEC (thermal electric cooler) and heat pipe technology for several years. TEC has great potential and opportunity for the thermal management of FPA (focal plane assembly), especially for IR-FPA (Infrared focal plane assembly). Our partners in Taiwan started focusing on the InGaAs detector arrays, because the detecting bandwidth is much wider than silicon-based CCD/CMOS. Recently, the IR-FPA products are successfully mass-produced in Taiwan. TEC cooling modules are embedded in the IR-FPA to lower the dark current. Better cooling of the FPA gives us higher SNR (signal to noise ratio), which is preferred in our optical payload. We will review the development of IR-FPA and TEC in Taiwan. The thermal management of the focal plane assembly shall be preliminarily studied by our team. Different types of IR-FPA are further studied as well. The irradiance of FPA of the optical payload can be calculated for different parameters such as orbit attitude and FOV (field of view), so the theoretical SNR can be estimated for specific detector temperature. Some physical principles are also included in this paper to give us better understanding of the thermal management of IR-FPA. The IR-FPA technology could be used in HSI Hyper-Spectral Imager, which could be one of the payloads of our FORMASAT satellites in the future. In Taiwan, We had the HSI user conference to discuss the user requirements and applications in December 2010. The development is now in phase zero and some early results of the HSI prototype development will be shown in this paper as well.
B. J. Wang,
Hsinchu Science Park 30078, Taiwan,

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