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Applicability of Existing Reliability Models: Focus on Finite Element Modeling of Various BGA Package Designs and Materials
Keywords: Package Reliability, Design effect, Materials & Processing Effect
Ball Grid Array (BGA) using lead-free or lead-rich solder materials is widely used as Second Level Interconnects (SLI) in mounting packaged components to the printed circuit board (PCB). The reliability of these solder joints is of significant importance to the performance of microelectronics components and systems. Product design/form-factor, solder alloys, and the inherent variability in materials and/or geometry greatly influence product reliability. Accurate reliability analysis is needed to account for these factors and their synergistic effect. Data on loading condition, materials properties, defect, and their statistical distribution are required in developing an integrated methodology for predicting reliability in packaging systems (IMPRPK). Our IMPRPK approach is based on a probabilistic methodology, focusing on three major tasks of (1) Finite Element analysis (FEM) to predict loading conditions, (2) Characterization of BGA solder joints to identify failure mechanisms and obtain statistical data, and (3) development of a probabilistic methodology to achieve an integrated reliability solution. The focus of this paper is on FEM (task 1), evaluating the effect of package design/form-factor and solder materials on the extent of deformation (e.g., inelastic stress/strain and strain energy density) experienced by BGA solder joints. Global and Local FEM results for two different package designs (Flip-chip and wire-bonded FLI) and two different BGA solder materials (lead-free SAC405 and lead-rich eutectic Pb-Sn) will be discussed. The FEM results and independent comparison with the accelerated thermal cycled (ATC) test data will be used to evaluate the applicability of the existing reliability models (e.g., energy-based model) to these systems.
Ali Fallah-Adl, Student
Arizona State University
Tempe, AZ
USA


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