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Solder Strength Characterization using Hot Bump Pull Testing
Keywords: Hot Bump Pull Testing, SAC 305, Aging
Hot and cold solder ball pull testing has emerged to be an attractive alternative to the traditional ball shear method for characterizing the attachment strength of solder interconnection. The tests are performed based on the JEITA EIAJ ET-7407 specification. This paper describes the formation and growth of intermetallic compound (IMC) at the interface of an Sn-3.0%Ag-0.5%Cu alloy. In addition, the effects of aging with relative humidity on solder strength are characterized and failure modes evaluated.
Arv Sinha, PhD, PE, Senior Scientist
IBM Corporation
Rochester, MN

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