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High Melting Temperature Lead Free Solder for Die Attach Application
Keywords: die attach, lead free solder, melting temperature
Lead-free solders are highly desirable to replace lead-based compositions due to environmental restrictions. We have developed two lead-free solders for die attach with excellent thermal performance and which melt in the desired temperature range. The bismuth-based solder has a melt temperature above 260C and good thermal conductivity. The zinc-based solder has a melt temperature below 350C and very good thermal conductivity. Both solders have acceptable wetting on bare copper or nickel-plated copper substrates, can be processed using a modified high-lead solder process condition, and survive a simulated 260C board-level reflow process. This paper discusses the solder material properties, and presents the die attach process and reliability test results in a manufacturing environment.
Jianxing Li, Principal Engineer
Honeywell Electronic Materials
Spokane Valley, WA
USA


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