Here is the abstract you requested from the IMAPS_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|High Melting Temperature Lead Free Solder for Die Attach Application|
|Keywords: die attach, lead free solder, melting temperature|
|Lead-free solders are highly desirable to replace lead-based compositions due to environmental restrictions. We have developed two lead-free solders for die attach with excellent thermal performance and which melt in the desired temperature range. The bismuth-based solder has a melt temperature above 260C and good thermal conductivity. The zinc-based solder has a melt temperature below 350C and very good thermal conductivity. Both solders have acceptable wetting on bare copper or nickel-plated copper substrates, can be processed using a modified high-lead solder process condition, and survive a simulated 260C board-level reflow process. This paper discusses the solder material properties, and presents the die attach process and reliability test results in a manufacturing environment.|
|Jianxing Li, Principal Engineer
Honeywell Electronic Materials
Spokane Valley, WA