Here is the abstract you requested from the IMAPS_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Design and Process Implementation for Embedding Components|
|Keywords: Embedded, microvia, multilayer|
|Although the printed circuit has traditionally served as the platform for mounting and interconnecting active and passive components on the outer surfaces, companies attempting to improve functionality and minimize space are now considering embedding a broad range of these components within the circuit structure. Both uncased active and passive component elements are candidates for embedding but the decision to embed components within the multilayer circuit structure must be made early in the design process. Some components are easy candidates for integrating into the substrate while other may involve more complex processes and will be difficult to rationalize. Although a many of the discrete passive and active devices may remain mounted on the outer surfaces of the multi-layer board, embedding passive components and one or more silicon based semiconductor elements within the inner layers of the structure will enable greater utilization of the circuit board structure. Benefits can include improved performance. For example, by embedding the uncased semiconductor element on an inner layer of the circuit vertically in-line with a related semiconductor package mounted on the outer surface, the conductor interface can be minimized. The close coupling of semiconductor elements significantly reduces inductance and contributes to increasing signal speed. The paper will include design guidelines, material selection and the use of micro-via build-up termination methodology for embedding and interconnecting miniature passive components; resistor, capacitor, inductor, discrete transistor elements and thinned semiconductor elements. Detailed process information and examples will be included to enable the product designer and manufacturing specialist to have a clear understanding of the principles for embedding and interconnecting components in an organic multilayer circuit board structure.|
|Vern Solberg, Sr. Consultant
Solberg Technical Consulting-Madison