Here is the abstract you requested from the IMAPS_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Materials Interaction in Cofired Platinum /Alumina High Density Feedthrough for Implantable Neurostimulator Applications|
|Keywords: platinum, alumina , cofired via|
|Neurostimulator applications will require much higher I/O feedthrough density for hermetic implantable enclosures, often greater than 100 I/O . This work evaluates the development of high density platinum via structure cofired in alumina. The platinum was observed to melt when cofired at 1550oC, 300oC below its melting point, independent of the particle size (nano to micron size particles) or particle morphology. An analysis of the effect of particle size (nano to micron size Pt), firing atmosphere (air, hydrogen, inert), firing temperatures (standard and nanoparticles alumina tape), intermetallic reactions and additives to control thermal expansion and adhesion strength was performed to evaluate and minimize this exothermic reaction. The interaction of platinum and alumina has been evaluated using X-ray diffraction, FIB sectioning with SEM and EDS analysis and TEM for each of these conditions.|
|Al Karbasi, Doctoral Candidate
Florida International University