Micross

Abstract Preview

Here is the abstract you requested from the IMAPS_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Improvement of Rated Power and VSWR Characteristics for Termination Resistor with Integrated Matching Network and Efficient Thermal Management
Keywords: Power Management, Footprint Improvement , Voltage Standing Wave Ratio
Matching RF and Microwave signals to components within a circuit has become more challenging for circuit designer as operating frequency and power handling requirement increase. Termination resistors with excellent power handling capability with superior voltage standing wave ratio (VSWR) characteristics are needed for microwave circuit components in various wireless and telecommunication application. In this work, we extensively studied to improve the power handling capability and VSWR characterization of termination resistor while maintaining the smaller size. We optimized the energy transmission within the component and significantly improved the efficiency of energy transfer between the transmission lines and the terminations. We explored several innovative techniques to optimize thermal management. We applied new packaging techniques and developed termination resistors with optimum thermal management. We discussed several methods of improving power handling capability and reduction of thermal fatigue to the component's structure by improving component packaging technology. Applying the packaging technology methods we significantly reduced the chance of solder cracking due to thermal fatigue. Employing novel techniques of heat transfer we appreciably increased power handling capability while keeping the product size as minimum. We constructed matching network using integrated microstrip line at the beginning of the resistor material. We optimized impedance matching by varying length, width and pattern of transmission line as well as using defective ground structure (DGS) technique. We minimized the detrimental influence of component footprint and resistor material characteristics effect on signal reflection. Considering microwave parameters and required thermal performance, we designed and manufactured Pb free high power termination resistor. Several sizes of resistor are manufactured with rated power of 20 W, 40 W and 100 W which provides excellent VSWR characteristics for RF and Microwave frequency. Resistors are manufactured for 50 ohm impedance; however, methods mentioned in the study are applicable to any impedance.
Akhlaqur Rahman, Product Development Engineer
Thin Film Technology Corporation
North Mankato, MN
USA


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems