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High Yield Process Improvements for High-Reliability HB-LED Automated Assembly
Keywords: HB LED Assembly, LED epoxy die attach and wire bonding, LED packaging process flow
Today, die bonders can perform epoxy die attach at a rate of 1.5 to 4 thousand die per hour; and wire bonders can interconnect complex packages at speeds of more than 10 wires per second. However, there is one major concern with operating at these speeds. The advantage of automation is speed and consistency—which can, consequently, also mean if something in the assembly process is wrong, everything will be wrong. Having a tightly regulated process flow helps avoid the risk of building a large batch of rejected product in a short period of time. Palomar Technologies Assembly Services general manager, Don Beck, presents a process flow of high-yield HB LED automated assembly, supported by equipment certification, product inspection and SPC data collection methods. In the past five years, Mr. Beck has managed the development of several cutting edge microelectronic LED light modules, taking this new technology from prototype to high-volume production. The methods presented in this presentation have been formulated through extensive work in the high-reliability microelectronics industry and commercial production lines over the last three decades. To ensure product and time-to-market success in high-volume, high-reliability commercial HB LED production, specific methods to achieve throughput and quality are required. This presentation will cover the ultimate goal of an automated precision HB LED assembly—to blend the quality required to support high reliability with the speed needed to support high-volume commercial production.
Donald Jay Beck, General Manager
Palomar Technologies
Carlsbad, CA
USA


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