Here is the abstract you requested from the IMAPS_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|AUTHOR WITHDREW 8-31-11: Inclusion of Trace and Plane Joule Power Dissipation in a Coupled Electromagnetic and Thermal Analysis of a Printed Circuit Board in an Enclosure|
|Keywords: Thermal Design, Full wave PCB analysis, Joule heating|
|AUTHOR WITHDREW 8-31-11: It has long been known that high fidelity thermal simulations of printed circuit boards (PCB) housed within an enclosure requires the inclusion of all relevant heat sources and knowledge of all modes of heat transfer conduction, convection and radiation within the enclosure. While there are a number of methods available that allow an engineer to perform thermal analysis of a PCB inside an enclosure that take into some or all of the heat transfer modes, the characterization of the heat sources has been limited to simply including the packages that populate a PCB. Customary thermal design have generally not included the vias, trace, and plane Joule power dissipation. As a result thermal analyses that only include the power dissipated in a chip or package as a heat source, often provide insufficient data or incorrect final operating temperatures. An ever increasing number of designs must now include all heat sources which necessitates the inclusion of via, trace, and plane Joule power dissipation that are a result of DC IR losses. This paper will show how it is now possible to perform a closed loop or bi-directional full|
|Steve Pytel, Product Manager, Signal Integrity