Here is the abstract you requested from the IMAPS_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Making Intelligent Tradeoffs Between SI, PI and EMI|
|Keywords: SI, PI, EMI|
|Old email as of 7-29-11 (firstname.lastname@example.org) Now will Avago Technologies - P: 510-825-9555; email@example.com. The trend of ever-increasing data rates and pressure to reduce cost is having significant impact on PCB, Package and High-Speed System design. More and more data signals are being cramped in smaller spaces. Proper power and ground planes are a luxury many designers do not have. As a result, SI, PI and EMI design is becoming more challenging. To further complicate things, a design that is optimized for SI or PI may be really bad for EMI. This requires that the designers make intelligent tradeoffs between SI, PI and EMI design targets. In this paper, we'll show a design methodology that shows how to simulate and optimize for SI, PI and EMI all at the same time, so that proper design tradeoffs can be made.|
|Amolak Badesha, Senior Application Expert
Agilent Technologies (left Agilent on 7-29-11) Now with Avago Technologies - firstname.lastname@example.org - P: 510-825-9555
Santa Clara, CA