Here is the abstract you requested from the IMAPS_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|AUTHOR WITHDREW 9-12/9-13-11 per Kishio-san: Wafer Level Process Compatible Underfilling Pre-Applied Film Adhesive for Flip Chip and 3D Package|
|Keywords: Non conductive film, Cu pillar, underfill|
|AUTHOR WITHDREW 9-12/9-13-11 per Kishio-san: Demanded features of 3D and fine pitch flip chip bonding adhesive is discussed and the developed material is introduced, which is wafer level process compatible uderfilling pre-applied adhesive film. Cu pillar with solder cap and Cu pad bonding which is going to be one the major fine pith bonding technologies was demonstrated using the film.|
|Toshihisa Nonaka, Chief Research Associate
Toray Industries, Inc.
Otsu, Shiga 520-0842,