Here is the abstract you requested from the IMAPS_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|The Adhesion Property Improvement by Forming Specific Patterns on a Surface of a Photosensitive Insulating Layer|
|Keywords: photosensitive insulating layer, adhesion property, peel strength|
|Recently, as slimness, lightness and smallness of a substrate functioning as an interposer between a substrate and an electronic device has advanced at a high speed, a seed layer for forming patterns is formed by using sputtering for a substrate capable of realizing high density and fine pattern. However, the seed layer formed by using the sputtering causes a problem of decreasing the adhesion with an insulating layer, and thus, it is urgently needed to solve this problem. The present experiment has been made in an effort to provide a method for manufacturing the same capable of improving adhesion between a seed layer and an insulating layer by forming a specific pattern of roughness on a surface of a photosensitive insulating layer. The experiment process is as below. A base substrate having connection pads is prepared and an insulating layer is formed on the base substrate. The insulating layer with photosensitive property is for protecting and insulating an upper surface of the base substrate. A mask is disposed over the insulating layer, and then a roughness is formed by using a photolithography including exposing and developing processes. Seed layers are formed on the surface of the insulating layer. The first seed layer works as a layer of improving the adhesion between the connection pads of the base substrate and the insulating layer. The first seed layer is usually used a titanium (Ti) layer or a nickel-chromium (Ni-Cr) layer. Also, the second seed layer works as a seed layer for the circuit pattern layer. The circuit pattern layer using electrolytic plating is formed on the second seed layer exposed by the pattern. Adhesion property between a seed layer and insulating layer was evaluated by peel strength test. As increasing specific pattern depth on a surface of insulating layer, peel strength value was improved. Average 0.99 Kg•F/cm was shown at the about 2um pattern depth. It was improved by 2 times, compare with no patterns of insulating layer surface.|
|Yoon-Su Kim, Senior Engineer
Samsung Electro-Mechanics, Co., LTD.
Suwon, Gyunggi-Do 443-743,
Republic of Korea