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Universities’ Researches and Education in Mainland China
Keywords: packaging research, advanced packaging, SiP
Mainland China is becoming one of the most important electronic packaging base of the world. Researchers in the universities are facing great challenges, as well as great opportunities. There are few of universities working on packaging researches ten years ago. But now, almost all the toppest universities have got funding on packaging from government or industry. Some hot topics would be descripted in this paper.
Jian Cai, Associate Professor
Tsinghua University
Beijing 100084,

  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems