Here is the abstract you requested from the IMAPS_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Cost-Effective Precision 3D Glass Microfabrication for Electronic Packaging Applications|
|Keywords: interposer, glass, APEX|
|Today's packaging has become the limiting element in system cost and performance for IC development. Assembly and packaging technologies have become primary differentiators for manufactures of consumer electronics and the main enabler of small IC product development. Traditional packaging approaches to address the needs in these “High Density Portable” devices, including FR4, liquid crystal polymers, and Low Temperature Co-Fire Ceramics, are running into fundamental limits in packaging layer thinness, high density interconnects (HDI) size and density, and do not present solutions to in-package thermal management, and optical waveguiding. In this talk, Life MicroFab will present on our efforts to create advanced microelectronic packing solutions using our APEX™ Glass ceramic which offers a single material capable of being simultaneously used for ultra-HDI through glass vias (TGVs), optical waveguiding, and in-package microfluidic cooling. APEX™ Glass ceramic is a photo-definable glass material that is processed in three simple steps using 1970's semiconductor processing techniques. Through exposure, baking, and etching steps, complex 3D architectures, with micron-scaled precision may be microfabricated using batch processing. We will present our efforts in exploring this material to produce (1) ultra-HDI glass interposers, with TGVs as small as 12 microns, with 14 micron center –to-center pitch, (2) advanced RF packages with unique surface architectures designed to minimize signal loss, (3) creating wave guiding structures in HDI packages, and (4) building in-package microfluidic systems for electronic cooling. Additionally, we will present on microfabrication process flow, microstructure and TGV fidelity, and manufacturing capability and limits.|
|Jeb H. Flemming, Chief Engineering Officer