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Here is the abstract you requested from the IMAPS_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Conductive Performance and Cure Depth of Copper Conductive Screen Ink Based on Pulsed-Light Modulated Copper-Oxide Reduction Technology
Keywords: Conductive inks, Copper, Flash-lamp processing
Recently, the performance of conductive inks based on copper-oxide reduction technology as embodied in a screen-print ink suitable for use on paper substrates has been described. Sheet resistances as low as 40 milliOhms/square were obtained with open ambient-air processing using 110lb card stock paper substrate. Processing times on the order of 2 milliseconds were required using a flash-lamp pulsed-light processing tool. The presented inks typically had thicknesses of 5 microns. Subsequent evaluation has shown that the depth of the conversion is not always full-depth of the ink deposition. The authors will present that the depth of conversion, and subsequent conductive performance, is heavily dependent on the water content remaining in the ink at the time of curing with flash-lamp processing equipment. Factors affecting the water content at the time of curing are identified as the water content of the initial ink formulation, the details of thermal pre-processing prior to the pulsed-light modulated copper-oxide reduction sequence, and the porosity and related attributes of the paper substrate.
Dave Pope, Senior Formulation Chemist
NovaCentrix
Austin, TX
USA


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