Here is the abstract you requested from the IMAPS_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|AUTHOR WITHDREW 9-6/9-9: Performance of a Ceramic-Based Flat Plate Heat Pipe for Electronics Cooling|
|Keywords: Flat Plate Heat Pipe, Passive Cooling, Ceramic|
|AUTHOR WITHDREW 9-6/9-9: Heat dissipation has become a major hurdle for the electronics industry, especially as higher performance integrated circuits are being developed for the power industry. Two of the primary hurdles in dissipating this heat are: 1) the thermal contact resistance between the IC and the cooling device, and 2) the ability to effectively spread the heat, such that traditional cooling technologies can be effective. By selecting ceramic materials that are thermo-mechanically matched (CTE) to IC materials, the proposed heat plate can be directly bonded by typical solder or braze techniques to the back-side of the IC. This eliminates thermal resistances due to contact and thermal interface materials. Within these flat plate heat pipes, a three dimensional network of gas channels and fluid wicks spread the high-flux heat loads from localized hot spots to the surrounding regions via phase change fluids and mass transport. Like traditional heat pipes, these flat plate heat pipes operate at nearly uniform temperature due to the phase change. The internal networks provide for multi-dimensional heat and mass flow, increasing their dissipating capability. The cooling performance of flat plate heat pipes will be presented. the contact resistances and the heat dissipation prototypical. In particular, results from both the thermal contact studies and the lateral heat spreading studies will be shown.|
|Merrill A. WIlson, Senior Engineer
Salt Lake City, UT