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|AUTHOR WITHDREW 8-25-11: BGA Substrate Material Property Measurement vs. Predicted Values|
|Keywords: Substrate, Modulus, Metal Density|
|AUTHOR WITHDREW 8-25-11: BGA package substrates are comprised of multiple materials, including laminate, copper and soldermask. Mechanical properties (modulus, CTE) of these component materials are usually measured and catalogued by material suppliers, but the resultant properties of the finished substrates are typically not measured. Also, these resultant properties will be applicable to the stack-up and metal patterns in a specific design. We have measured the modulus of several substrates of various materials, layer count and metal patterns. Two techniques, DMA and 3-point bending were employed. Additionally, the expected modulus was calculated based on the stack-up, component material properties, and metal density and pattern. Good agreement was found between the measured and calculated values. Thus a technique is available for estimating the modulus of new substrate configurations before fabrication.|
Freescale Semiconductor, Inc.