Here is the abstract you requested from the IMAPS_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Extreme Temporary Coatings and Adhesives for High-Thermal, Low-Pressure, and Low-Stress 3D-Processing|
|Keywords: Adhesive, Thermal, Outgas|
|Although several materials are commercially available as temporary adhesives in 3-D packaging, few are candidates satisfy processes of elevated temperature and extreme vacuum. Ideal candidates may include thermoplastic or thermosetting polymers, however, they must be processed in a manner that meets the customer's. This paper presents data on several products and methods of modeling a customer's process. Low-cost alternatives will be presented which may be easily integrated, provided that a customer's process can be tuned to accept such materials. Low-cost temporary support materials allow grinding and polishing to <20um while also protecting front side devices from backside processing to include through silicon vias (TSVs) and the associated cleans and metallization steps. Temporary adhesives must sustain thermal resistance to 250C, vacuum conditions of 10-6 Torr, and shear forces of grinding processes. These properties are required for via etch, CVD processing (e.g. oxide deposition), and chemical use during cleaning. These efforts are aimed at simplifying the overall process, aligning chemistry, and many times, eliminating the need for complicated cleans. By tailoring a customer's process to accept a lower-cost adhesive, new ways of simple and rapid cleaning or even detergent washable systems may be integrated. Using these approaches, a safer working environment, or green factory, may be achieved while reducing the use of organic solvents and eliminating waste. Several options will be presented for using low-cost adhesives in thinning and backside processing towards increasing throughput and reducing cost. Examples will include semiconductor wafer and die thinning and at least one non-semiconductor thin substrate practice.|
|John Moore, President