Here is the abstract you requested from the IMAPS_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|AUTHOR WITHDREW 8-22-11: Acceleration Factors for Reliability Testing of Molded Case Tantalum Capacitors|
|Keywords: reliability, capacitor, acceleration factor|
|AUTHOR WITHDREW 8-22-11:The existing method of calculations of failure rates for established reliability chip tantalum capacitors is based on voltage acceleration factors that are assumed to be the same for different part types. This approach can result in significant, up to three orders of magnitude, errors in reliability predictions and is limited to a specific temperature only. To avoid errors and predict reliability at different operational temperatures, there is a need in a method that would allow for fast and effective estimations of voltage and temperature acceleration factors for a specific type of capacitors. In this paper, a physical model presenting failures of tantalum capacitors as time-dependent-dielectric-breakdown (TDDB) is described and validated experimentally by temperature dependence of breakdown voltages of capacitors and life testing in a wide range of temperatures and voltages. Highly accelerated life testing (HALT) and step stress testing are carried out for five different types of capacitors. Parameters of the model and acceleration factors are determined using a cumulative damage or general log-linear model at two stress levels.|
|Alexander Teverovsky, Scientist
Dell Perot Systems