Micross

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Comparison Between Multilayer Ceramic and Organic Package Substrates Based Upon Signal and Power Integrity
Keywords: Ceramic, Signal Integrity, Electronic packaging
For many applications, the material selection process can be a difficult task based upon including trade-offs between cost, environmental, thermal, mechanical, and electrical requirements. In any comparison between ceramic and organic technologies it is most often the case that ceramic solutions cannot be competitive based on cost alone. However high-speed and mixed-signal applications continue to demand higher density and higher performance from the package substrate. In those cases where performance requirements make cost a secondary consideration, it becomes of strong interest to place a heavier weight on the technical parameters in the design trade-off space for various package substrate technologies. There are also applications where environmental requirements dominate the design trade-off space and require an existing organic technology solution to be converted to a ceramic technology solution. In these cases it becomes necessary to understand the performance trades between the previously existing organic solution and a potential ceramic solution. This paper presents a power and signal integrity comparison between various multilayer organic and multilayer ceramic technologies. We compare key high-speed transitions between the organic and ceramic technologies at the package first and second level interconnects, and discuss the limitations and advantages of the design rules associated with each material process technology. We also apply and discuss the design methodology of identifying a target impedance for the power distribution network for each material technology. Organic substrate design rules have an inherent advantage in power integrity comparisons, however we present mitigation approaches for the ceramic technology.
Jerry Aguirre, Senior Engineer
Kyocera America Inc.
San Diego, CA
USA


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