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Next Generation Micro-Packaging
Keywords: micro-packaging , high density, Micro-dispensing
Next generation micro-packaging will include a number of advances in high density techniques; more components in a smaller volume. New techniques for metallization, passives, antennas, solders and adhesives will be required. The key factor for these will be size constraints. Micro-dispensing has the ability to print a number of materials to include dielectrics, ruthenates, metallics, solders and adhesives. Those with experience in micro-dispensing recognize the size limitation using a dispensing approach and the hope of achieving smaller line widths, smaller pad sizes and precise placement of the material is not feasible. nScrypt has demonstrated the ability to considerably shrink the line widths and dots from traditional micro-dispensing, thus enabling the next generation package and increasing the component count in the same or less volume. Micro-dispensing solder dots, precisely placing narrow adhesive lines and potentially directly printing resistors and antennas to replace standard pick and place and connectorized antennas will be demonstrated to reduce the size and volume for high micro-electronic circuits. In addition to the new and enabling reduced volume approach, nScrypt will also demonstrate how the speed of this approach will rival traditional high volume screen printing and other masking technologies, thus making this a viable manufacturing tool for micro-packaging.
Xudong Chen, Director of Direct Printing
nScrypt, Inc.
Orlando, FL
USA


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