Here is the abstract you requested from the IMAPS_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|AUTHOR WITHDREW 8-31-11: Sensitivity Analysis-Based Design of Low Temperature Cofired Ceramic Multi Chip Modules in High Reliability Applications|
|Keywords: Multi-Chip Module, LTCC, Design|
|AUTHOR WITHDREW 8-31-11: Developing a low temperature cofired ceramic (LTCC) multi chip module (MCM) for high reliability applications presents many difficulties. The MCM must survive many temperature cycles, ranging from -55 °C to 125 °C, which can compromise the structure, hermiticity, and the electrical functionality of the MCM. Prototyping has shown ceramic and solder interface cracking in the MCM assembly. The failure mechanism is primarily a result of mismatched coefficients of thermal expansion in rigid components. To mitigate future ceramic and solder cracking, the LTCC MCM was redesigned with increased strain relief by changing materials and device geometry. A Method of Morris sensitivity analysis was performed to determine the factors which have the greatest influence on alleviating interfacial stresses. The results show that increasing the seal frame thickness and reducing the seal frame height drastically decreased the interfacial stresses and minimized cracking. After optimizing the design, the stresses were reduced by 25%.|
|Nathan Young, Senior Member of Technical Staff
Sandia National Laboratories