Here is the abstract you requested from the IMAPS_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Evaluation of AuSn Eutectic Die-Attach Materials Designed for High Brightness LED Packaging|
|Keywords: LED, Die Attach, Gold Tin Solder|
|High-power semiconductor devices, such as high-brightness LEDs, must be mounted using a robust die-attach material that can handle the temperature fluctuations generated by the chip, as well as the mechanical stresses due to CTE mismatches between the die material and substrate to which it is mounted. The selected material must also comply with current legislation that restricts manufactured products containing certain materials due to environmental concerns, which have been popular in this application for many years. Eutectic gold-tin (AuSn) materials that meet these new legislative requirements will be presented, along with process recommendations for their implementation. Utilizing Palomar Technologies' die bonder, AuSn solder preforms and paste will be placed/dispensed and reflowed using a Pulse Heat System (PHS) and test data will be discussed. In addition to process recommendations, the data presented may also be used to derive expected LED performance.|
|Amanda Hartnett, Applications Engineer