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Evaluation of AuSn Eutectic Die-Attach Materials Designed for High Brightness LED Packaging
Keywords: LED, Die Attach, Gold Tin Solder
High-power semiconductor devices, such as high-brightness LEDs, must be mounted using a robust die-attach material that can handle the temperature fluctuations generated by the chip, as well as the mechanical stresses due to CTE mismatches between the die material and substrate to which it is mounted. The selected material must also comply with current legislation that restricts manufactured products containing certain materials due to environmental concerns, which have been popular in this application for many years. Eutectic gold-tin (AuSn) materials that meet these new legislative requirements will be presented, along with process recommendations for their implementation. Utilizing Palomar Technologies' die bonder, AuSn solder preforms and paste will be placed/dispensed and reflowed using a Pulse Heat System (PHS) and test data will be discussed. In addition to process recommendations, the data presented may also be used to derive expected LED performance.
Amanda Hartnett, Applications Engineer
Indium Corporation
Clinton, NY
USA


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