Here is the abstract you requested from the IMAPS_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Topography and Deformation Measurement as a new Tool for Thermal Stress Assessment on Electronics Components|
|Keywords: thermal , stress, reliability|
|Requirements on electronics components are more and more demanding, and might be of extremely various kinds: the Automotive and Space industries typically require “zero defect” quality, which in practice means overall failure rates in the ppb range. Speed and energy critical applications are the drivers for the development of 3D die stacks and PoP designs, with the particularity that these components are facing at least 2 reflow solder cycles up to 260°C instead of only one. MEMS solutions typically include a cavity inside the package, with the specific demand for minimum component warpage during production in order not to damage the cavity by the mechanical package deformation under heat stress. Recently, Topography and Deformation Measurement (TDM) has been developed as a novel tool for the reliability analysis on innovative component and package designs in the very early development phase. It can be used to optimize the warpage behaviour of any new component under any kind of realistic thermal stress condition: reflow solder conditions, expected product life cycle thermal conditions, or accelerated aging test conditions are some of the potential applications. After a short introduction concerning the benefits of TDM for innovative component design, the present paper will deal with several case studies: In the first, TDM is used to minimize the maximum warpage of a MEMS component's package during reflow, with the final aim to reduce this maximum warpage by at least a factor of two compared to “standard” reflow. In the second, TDM will contribute to the fundamental research on die thinning for 3D applications, and process development for 3D stacking. Finally, a third case study will highlight the stress interaction between a component and a PCB, by analyzing the topography vs. temperature characteristics of the component before and after soldering it onto the PCB.|
|Michael Hertl, CTO