Here is the abstract you requested from the IMAPS_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Printable Materials and Devices for Next Generation Packaging|
|Keywords: Printable Materials, Printable Devices, Next Generation Packaging|
|In recent years significant progress has been achieved in the development of semiconductor packaging technology using various printing methods such as screen-printing, ink-jet printing, and microcontact printing. This trend is driven by demand for low cost, large area, flexible and lightweight devices. For these purposes, printable materials have been widely pursued since they offer numerous advantages for easy low temperature processing, compatibility with organic substrates, and great opportunities for structural modifications. In this work we report novel printable materials that have the potential to surpass conventional materials to produce fine structures compatible with organic substrates. Specifically we discuss the electronic applications of printable materials such as adhesives (both conductive and non-conductive), interlayer dielectrics (low-k, low loss dielectrics), embedded passives (capacitors, resistors), circuits, etc. We are also investigating printable materials for fabrication of devices such as inductors, embedded RFID, and optical interconnects. The study also evaluates the suitability and capability of the inkjet printing technology for the manufacturing of high-performance electronics. A variety of ink-jet printable circuits and their stability under various printed wiring board and laminate chip carrier fabrication process will be presented.|
|Rabindra N. Das,
Endicott Interconnect Technologies