Here is the abstract you requested from the IMAPS_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|AUTHOR WITHDREW 9-2-11: Isothermal Fatigue Tests of SnPb, SnPbAg and SnBi Solder Joints|
|Keywords: solder alloy, isothermal, tin|
|AUTHOR WITHDREW 9-2-11: Solder alloys like Sn63-Pb37 and Sn62-Pb36-Ag2 are commonly used in surface mounted components (SMT) for electronic equipment those require high reliability. Lead presents high toxicity and it was eliminated in some electronic components soldering process. Under thermal cycling conditions solder joints cold fail and accelerated thermal cycling (ACT) has been used to study either SnPb or Pb-free alloys to verify the reliability of solder joints. The objective of this research is to characterize and analyze the isothermal fatigue strength of copper joints soldered with Sn63-Pb37, Sn62-Pb36-Ag2 and Sn42-Bi58 solder alloys commercially available to compare the results to those obtained when using thermal cycling tests. The samples were submitted to isothermal fatigue tests and were made up of two copper wires with a 1.6mm diameter soldered at the top (butt joint). The statistical method used to obtain and analyze the experimental data of the isothermal fatigue test was the staircase method. The obtained value for mean fatigue strength for the soldered joints with Sn63-Pb37, Sn62-Pb36-Ag2 and Sn42-Bi58 were 34+/-5 MPa, 38+/-2 MPa and 37+/-6 MPa respectively. The experimental fatigue tests results, the microstructure obtained after and before isothermal fatigue tests showing Pb islands growth, microstructure failures in SnPbAg and SnBi, and Sn-Pb fractography are presented.|
|Eliane M. Grigoletto, Professor
UNISAL College Center of Sao Paulo
Campinas, SP 13087-290,