Here is the abstract you requested from the IMAPS_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Packaging and Integration Concept for High-Performance and Cost-effective IQM-based Transmitter Module for 160 Gb/s Applications|
|Keywords: Photonic Packaging, Design Concept, 160 Gb/s Applications|
|Photonic communication modules operating with advanced modulation formats and improved spectral efficiency are gaining a dramatic interest due to the urgency to fit 100+ Gbit/s channels into existing DWDM systems. However, packaging and integration of IQM (In-phase/Quadrature Modulator) chips suitable for 100+Gb/s applications poses huge design and process challenges. For example, at these high-speeds, signal reflections caused by impedance mismatch at interfaces, severe insertion loss mainly due to resonances from packaging interconnections like vias as well as cross-talk and undesired electromagnetic interference (EMI) may severely degrade the performance of the modulators beyond acceptable limits. Furthermore, heat dissipated from terminating resistors may also cause reliability issues. When these problems occur, the functionality of the module cannot longer be guaranteed. In this contribution, we present a systematic concept for efficient and cost-effective packaging and integration of a 4 x 43 Gb/s Polmux RZ-DQPSK transmitter module for 160 Gb/s applications. This concept takes into consideration the above-mentioned electrical and thermo-mechanical problems right at the beginning of the design cycle, so as to prevent any system failure or possible re-designs. The two InP IQM chips are flip-chip bonded on a BGA-based ceramic package, preserving signal integrity, simplifying routing and dramatically minimizing overall size and assembly costs. The BGA module is cooler-less and also includes a highly stable optical coupling system.|
|Giovanni Delrosso, Manager, Sr. Packaging Technology Advisor
COGO OPTRONICS GmbH