Micross

Abstract Preview

Here is the abstract you requested from the IMAPS_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Overview on Thermal and Mechanical Challenges of High Power RF Electronic Packaging
Keywords: RF power amplifier, thermal analysis, ceramic packaging
Making information available anywhere at any time relies on connectivity and communications, increasingly via the use of wireless-based networks. In common with security, communications is a common factor driving functionality for a broad and still expanding portfolio of products and services RF power amplifiers are widely applied in the mobile phone base stations, broadcasting, microwave radar system and industrial, scientific and medical (ISM) radio bands applications. The RF power amplifier (RF PA) solution is a high technology intensive and expert-based business. Market demands for high power, high operation frequency, high linearity concern, high efficiency and attractive price. Therefore, the further developing of the RF power products required extensive knowledge/experts on the Si LDMOS/SiC GaN process technology, Dorhety/Switch-mode architecture design and low-cost/high reliability packaging solutions. Thermal performance is an essential design requirement, in order to secure the RF PA performance. It is well known that the IC performance and reliability exponentially degraded by the increasing of the IC temperature (junction temperature, Tj). As the market demand of high power, the not only relay on new/novel high thermal efficiency material, but also highly reliable and defect-free process. On the other hand, the application of high performance RF PA is not limited to basestations, microwave, digital-TV, but gradually penetrate into industrial, scientific and medical (ISM) market. The low-cost packaging solution is demanded and overmolded plastic packaging (OMP) is developed. One of the challenges of RF PA OMP is the Al wire shape. Via the multiphysics/multiscale finite element (FE) modelling technique, recommendations are made regarding the design space for the design of an aluminium wire bond (wedge-wedge). In this paper, we will overview the generic thermal and thermal-mechanical challenges of the RF PA packages. Moreover, the multi-physics reliability behaviour of the Al wire in OMP will be reviewed.
Cadmus Yuan, Senior Scientist
TNO
Eindhoven 5612AP,
Netherlands


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems