Here is the abstract you requested from the IMAPS_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Sputter Deposition of Thin Film MIM Capacitors on LTCC Substrates for RF Bypass and Filtering Applications|
|Keywords: LTCC, Thin Film, Capacitor|
|Thin film capacitors for GHz filtering applications were sputter deposited onto low temperature co-fired ceramic (LTCC) substrates. The capacitors were configured in a metal-insulator-metal (MIM) layout featuring 200 nm thick Al electrodes and a 300 nm thick Al2O3 dielectric layer, with dimensions varied between ~150x150 μm and ~750x750 μm. DC current-voltage measurements (E ≤ 5 MV/cm) coupled with impedance analysis (≤15 MHz) was used to characterize the resulting devices. More than 90% of the devices functioned as capacitors with high DC resistance (>20 MΩ) and low loss (<0.1). A second set of capacitors were made under the same experimental conditions into device geometries optimized for high frequency (≤200 MHz) impedance analysis. These capacitors featured temperature coefficient of capacitance (TCC) values between 5 and 10% as well as low loss values (<0.03). Capacitance and loss values were comparable between the capacitor structures of similar areas at the different frequency regimes. *The Kansas City Plant is operated and managed by Honeywell Federal Manufacturing & Technologies for the United States Department of Energy under contract No. DENA0000622|
|J. Ambrose Wolf, Scientist Principal R&D
Kansas City, MO