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High Temperature Au Based Solder Reliability in Electronic Packages for Harsh Environments
Keywords: Au-Si, reliability, nano-indentation
The operation of electronic packages in high temperature environments is a significant challenge for the microelectronics industry. It poses a challenge to the traditional temperature limit of 125C for high electronic systems, such as those found in down-hole, well-logging and aero-engine applications. The present work aims at developing understanding of how and why attach materials for Si dies degrade/fail under harsh environments by investigating a potential candidate for this purpose: high temperature Au based solders. Au-2wt.%Si eutectic melts at <400C, offers high temperature stability, and is stiffer. The high temperature processing and the complex manufacturing steps are the major drawbacks. Bond quality inherently variable was widely studied. Changes in the die attach material was investigated by isothermal ageing at 250C and 300C, thermal shock and thermal cycling treatments. The failure behaviour of the die attach materials included cracking of die and/or attach material, delamination and voiding. SAM images provided a rapid and comprehensive imaging of package defects and their location within the package. Microstructural analysis and die shear testing were also carried. Nanoindentation has been used to evaluate the modulus of the die attach material before and after thermal exposure. Numerical modelling has also been used to better understand the reliability performance. This work formed part of the UPTEMP project which was set-up with support from UK Technology Strategy Board and the EPSRC.
M.F. Sousa, Ph.D. Student
Oxford University
Oxfordshire, OX3 1PH,
United Kingdom


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