Abstract Preview

Here is the abstract you requested from the IMAPS_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

The Léti Two-Step Approach in the Domain of 3D Integration
Keywords: 3D integration, R&D, TSV
In a first time confined to labs and then R&D centers, 3D integration technologies have now gained maturity and are now penetrating the industrial world. More and more, R&D centers are approached to back the industrial developments with associated constraints of swift product development, prototyping, and short time-to-market. To face this paradigm, Léti has developed a specific two-step approach in the field of 3D integration, including both a very advanced R&D part focused on the most promising technologies and integration flows, and the industrial validation of the most mature process flows already assessed at the laboratory scale or on specific industrial themes. This talk aims to detail the two aspects of this dual approach: -In the first part, we will give an overview of the innovative R&D performed on the still nascent and most promising integration flows, as well as the associated technological means. -in the second part, we will present the prototyping activities that Léti is now offering. Based on a limited number of mature and already validated process steps (bonding and thinning, TSV, bumping, stacking) this generic integration scheme allows industrial customers to assess on their own wafers the benefits of an innovative 3D integration.
André Rouzaud, Dep. VP Micro-Systems and 3D Integration

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic