Micross

Abstract Preview

Here is the abstract you requested from the IMAPS_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Applications of 3D X-Ray Microscopy for Advanced Package Development
Keywords: 3D X-Ray Microscopy, Failure Analysis, Advanced Package Development
The main drivers in advanced packaging development are reducing form factors and cost and increasing speed and bandwidth. These trends result in increasingly complex 3D structures with new failures. Isolating the failure mode becomes challenging because they are typically buried inside. Traditional methods often provide incomplete information limiting root cause analysis. These examples illustrate some new challenges. Smaller form factors requires finer pitch packages and interconnects that must carry higher current at elevated operating temperature for long time periods. Electro-migration related failures at the package interconnect has become a concern in the packaging community. Building accurate predictive models to optimize structures for increased lifetime performance requires strong correlation of theory with experimental results. Electro-migration failures are inherently three-dimensional yet the majority of analytical techniques are 2D. Multi-die stacking increases the bandwidth within package. In order to minimize packaging costs there is considerable effort made to maintain lower substrate layer counts and reduce the lines and spaces in the metal layer. While traditional inspection methods indicate a sound substrate, we have found unexpected failures. Substrate failure identification by physical removal of each layer is a tedious exercise that, does not provide information on failures at the via interconnects. Packaging of optical camera assemblies has advanced through the development of UV curable polymers which contain heavier elements such as Si and S. Measuring the lens prescription and delamination failures through the entire component are the new challenges. In this paper we will describe through these examples how X-Ray 3D Microscopy provides an effective non-destructive imaging solution to meet these challenges. For each case study we will describe our methodology and its impact on our advanced packaging development efforts.
Kevin Fahey, Vice President - Marketing
Xradia
Pleasanton, CA
USA


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems