Here is the abstract you requested from the IMAPS_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Electromagnetic Isolation Solutions in Low Temperature Cofired Ceramic (LTCC)|
|Keywords: LTCC, high frequency isolation, seal frame|
|LTCC is a commercial ceramic-glass multilayer technology for microelectronics, microsystems and sensors. High frequency applications require good electrical properties and newer applications require extreme isolation that is even difficult to measure (-150db). Approaches to providing this isolation, once provided by via fences, have included sidewall coating and full tape thickness features (FTTF) that have been introduced by the filling of slots with via-fill compositions. Several techniques for creating these structures have been modeled for stress and temperature effects in the face of other necessary attachments, such as metallic seal frames. The relative effects of attachment media, FTTF geometry, and alternative measures will be reported. Approaches for thick film and thin film implementations are described.|
Honeywell Federal Manufacturing and Technologies
Kansas City, MO