Abstract Preview

Here is the abstract you requested from the IMAPS_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Development of Laser Direct Ablation Process on Solder Resist in Printed Circuit Boards
Keywords: Solder resist, Laser direct ablation, Whitening defect
In recent, the laser direct ablation process(LDA) for opening solder resist(SR) is getting the spotlight because this process favors small size opening and process shortening. However, it is concomitant with a desmear process which causes SR whitening defect. The SR whitening, in general, is known to be caused by the diffused reflection of the SR surface reformed and coarsened by the chemical reaction between the permanganate and SR polymer components. The process comprising lamination of a protective film on the SR prior to conducting LDA is proposed to resolve the problem. Therefore, the whitening defect-free products can be obtained even after the wet chemical desmear or plasma desmear.
Changbo Lee,
Samsung Electro-Mechanics
Suwon-si, Gyeonggi-do 443-743,
Republic of Korea

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic