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Optoelectronic Substrate with High-Aspect-Ratio Optical Through-Hole for Chip-To-Chip Interconnects
Keywords: Optoelectronic, Chip-To-Chip, Interconnects
Signal integrity and power integrity have challenges for future high-end systems. The main issue in the signal integrity is bandwidth limit due to the copper line transmission loss. Optical interconnections have been proposed in place of the copper lines. The main challenge in the power integrity is to prevent IR drop on the power plane. Substrate manufacturers have developed substrates that have capacitors embedded into the substrates. In order to combine these two technologies, future substrates will need long optical ports to transmit optical signals through the substrates. We report high-aspect-ratio optical through-holes fabricated in optoelectronic substrates for chip-to-chip optical interconnections. They are used for transmitting optical signals vertically through the optoelectronic substrate. They consist of cladding layer and cores that are 55 μm in diameter. Their lengths are 1.2 mm equal to the thickness of the substrate. This small diameter enables the optical through-holes to achieve low-loss optical coupling with a graded-index optical fiber and a polymer optical waveguide. This thickness of the optoelectronic substrate accommodates embedded capacitor integration under CPUs and improves co-planarity for both package level and board level assembly. The optical characteristics of the high-aspect-ratio optical through holes were evaluated. We have measured optical loss and coupling tolerance of the optical through-holes to clear the effects of misalignment. The optical loss of core-cladding optical through-hole was 1.3 dB that was 2.9 dB better than that of only one kind of transparent resin and 3.8 dB better than that of a vacant drilled hole. The narrowest 1-dB coupling tolerance was +/- 12 μm from the transmitter optical through-hole to the optical waveguide. Total optical loss was estimated to be 6.8 dB from a vertical-cavity surface-emitting laser through 100-mm polymer waveguide with two 45-ended mirrors to a photodiode.
Atsushi Suzuki, Senior Research Engineer
NGK Spark Plug Co., Ltd.
Komaki-shi, Aichi, 4858510,
JAPAN


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